molding compound
EMC(EpoxyMoldingCompound)半導體等級封裝環氧樹酯.Definition&Features.Composition:EpoxyResin,Hardner,Filler(Silica),SomeAdditives,Moldcompoundsaretheplasticsusedtoencapsulatemanytypesofelectronicpackages,fromcapacitorsandtransistorstocentralprocess...
Molding Compound
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Inessence,themoldmaterialconsistsofsand,usuallysilicainaquartzform,clay,charcoalandwater.Atypicalcompositionforgreensandis:81wt% ...
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