molding compound
EMC(EpoxyMoldingCompound)半導體等級封裝環氧樹酯.Definition&Features.Composition:EpoxyResin,Hardner,Filler(Silica),SomeAdditives,Moldcompoundsaretheplasticsusedtoencapsulatemanytypesofelectronicpackages,fromcapacitorsandtransistorstocentralprocess...
EPOXY MOLDING COMPOUNDS
- lead frame鍍銀
- qfn
- bga封裝
- lead frame封裝
- lead frame substrate
- lead frame製程
- leadframe是什麼
- lead frame
- leadframe process
- lead frame鍍銀
- leadframe package
- lead frame中文
- QFP
- lead frame缺貨
- lead frame中文
- ppf leadframe
- leadframe種類
- lead frame導線架
- lead frame翻譯
- Stamped lead frame
- 導線架廠商
- lead frame導線架
- lead frame material
- 導線架廠商
- 導線架封裝
電晶體封裝.電晶體封裝成型材料,成型性佳及優良信賴性。Photocoupler封裝.
** 本站引用參考文章部分資訊,基於少量部分引用原則,為了避免造成過多外部連結,保留參考來源資訊而不直接連結,也請見諒 **