molding compound
EMC(EpoxyMoldingCompound)半導體等級封裝環氧樹酯.Definition&Features.Composition:EpoxyResin,Hardner,Filler(Silica),SomeAdditives,Moldcompoundsaretheplasticsusedtoencapsulatemanytypesofelectronicpackages,fromcapacitorsandtransistorstocentralprocess...
Semiconductor Epoxy Mold Compounds
- leadframe種類
- leadframe封裝
- Stamped lead frame
- flip chip on lead frame
- ppf leadframe
- leadframe package
- die attach
- leadframe process
- lead frame製程
- lead frame鍍銀
- leadframe package
- lead frame中文
- lead frame翻譯
- lead frame substrate
- lead frame中文
- lead frame material
- molding compound
- qfn
- lead frame製程
- led leadframe
- leadframe製程
- 導線架廠商
- lead frame鍍銀
- 導線架封裝
- lead frame缺貨
Semiconductormoldingcompoundsarefinefilled,electricallystablecompounds,idealfortheminiaturisedsemiconductorpackagingrequirements.
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