molding compound
EMC(EpoxyMoldingCompound)半導體等級封裝環氧樹酯.Definition&Features.Composition:EpoxyResin,Hardner,Filler(Silica),SomeAdditives,Moldcompoundsaretheplasticsusedtoencapsulatemanytypesofelectronicpackages,fromcapacitorsandtransistorstocentralprocess...
EMC
- lead frame substrate
- bga封裝
- QFP
- lead frame封裝
- Stamped lead frame
- leadframe種類
- lead frame material
- lead frame
- molding compound
- lead frame製程
- lead frame導線架
- led leadframe
- lead frame substrate
- lead frame封裝
- 導線架封裝
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- lead frame鍍銀
- leadframe package
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- leadframe是什麼
- lead frame導線架
- lead frame鍍銀
- die attach
EMC(EpoxyMoldingCompound)半導體等級封裝環氧樹酯.Definition&Features.Composition:EpoxyResin,Hardner,Filler(Silica),SomeAdditives
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