molding compound
EMC(EpoxyMoldingCompound)半導體等級封裝環氧樹酯.Definition&Features.Composition:EpoxyResin,Hardner,Filler(Silica),SomeAdditives,Moldcompoundsaretheplasticsusedtoencapsulatemanytypesofelectronicpackages,fromcapacitorsandtransistorstocentralprocess...
Molding Compounds
- lead frame導線架
- 導線架封裝
- lead frame鍍銀
- leadframe封裝
- leadframe process
- lead frame中文
- flip chip on lead frame
- Stamped lead frame
- die attach
- lead frame封裝
- bga封裝
- lead frame substrate
- ppf leadframe
- lead frame導線架
- leadframe package
- leadframe manufacturing
- lead frame翻譯
- lead frame material
- lead frame製程
- 導線架廠商
- lead frame製程
- lead frame缺貨
- lead frame缺貨
- leadframe種類
- leadframe製程
MoldingCompoundsarethermosettingplasticswithverygoodmechanical,electricalinsulationandtemperatureresistanceproperties.
** 本站引用參考文章部分資訊,基於少量部分引用原則,為了避免造成過多外部連結,保留參考來源資訊而不直接連結,也請見諒 **