![die attach](https://host.easylife.tw/pics/201709/Amplframe.png)
DAF(DieAttachFilm)為晶片黏結薄膜,用途是在雷射切割時,晶片可一起切割與分離,進行剝離(擴膜),使切割完後的晶片,都還可黏著在薄膜上,不會因切割而造成散亂排列。,Dieattachordiebondingistheprocessofattachingasemiconductordietoapackage,asubstratesuchasa...
Die Attach
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2023年5月31日—Dieattach,alsoknownasdiebondingordiemount,isaprocessusedinthesemiconductorindustrytoattachasiliconchiptothediepad ...
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