Hybrid bonding process
2024年2月19日—Thebacksideofthefirstwaferisthenthinneddown,andtheprocessiscompletedbyn-TSVpatterning,metalfill,andbacksidemetallization.,2022年7月29日—若接點間隙過小,迴焊過程(ReflowProcess)中兩相鄰銲錫球容易碰觸在一起,形成橋接失效(BridgeFailu...
EVG's die-to
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Wafer-to-waferhybridbonding,whichinvolvesstackingandelectricallyconnectingwafersfromdifferentproductionlines,isacentralprocessin ...
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