lead frame substrate
ThiscomprisesanovelmethodofexperimentallyanalyzingthetransientdriftbehaviorofaMEMScausedbyadeformationoftheMEMScorearea.Thisapproach ...,▫應用導線架(Leadframe)之引腳產品,藉由打金線.(wirebonding)之連接型態.▫基板(Substrate),以BGA型態封裝,以增加...
IC封裝體製程晶片厚度對金線偏移影響之研究
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▫應用導線架(Leadframe)之引腳產品,藉由打金線.(wirebonding)之連接型態.▫基板(Substrate),以BGA型態封裝,以增加引腳數目.(I/O).Leadframesubstrate.傳統 ...
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