The substrate is a small PCB with traces designed specifically for your package. The substrate is used for connecting the bumps to the solder balls and consists ...
ASE's substrate design and manufacturing capability enables the interconnection materials of a wide range of wire-bond BGA and flip chip product applications.
The substrate consists of an insulating material with conductive traces on or within it that route signals and power between the attached silicon die and the ...
SHINKO supplies organic substrates using prepreg for BGA packages for logic, memory, and sensor devices. 2 layers or 4 layers through-hole substrates are used ...
FC-BGA substrates. FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions.
2022年11月10日 — Choosing a suitable BGA substrate requires in-depth knowledge. In this guide, you will find all information you need to know about BGA ...
