Sony hybrid bonding
2020年10月1日—HybridbondingwentintovolumeproductionafterSonylicensedtheZibondtechnologyfromZiptronix(nowpartofXperi)andintroducedit ...,2021年5月23日—ThereisoneaspectapartfromthisbeingaSWIRsensor:Cu-Cuhybriddietowaferbondingof2componentsofcomplet...
Hybrid Bonding Moves Into The Fast Lane
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2022年7月21日—Wafer-to-wafer(W2W)hybridbonding,whichinvolvesstackingthewafersface-to-face,bonding,annealing,andthensingulatingthestack,hasa ...
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