Hybrid bonding TSMC
2024年6月4日—Withthoseoutoftheway,theuppermostinterconnectlevelscanconnectbettertosmallerhybridbondingbondpads,TSMCresearcherscalculate.,2024年2月9日—Hybridbondingisusedforthevertical(or3D)stackingofchips.Thedistinguishingfeatureofhybridbondingis...
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2024年4月18日—ThemostprominentadoptionofhybridbondingisAMDemployingTSMC's3DSOIC(hybridbonding)technologyforstackingL3cachedieontoa ...
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