What is ENIG? | PCB Knowledge

It consists of an electroless nickel plating, covered with a thin layer of gold, which protects the nickel from oxidation. The gold is typically applied by ...

2016年2月3日 — ENIG (Electroless Nickel Immersion Gold，無電鍍鎳浸金)，是一種用於電路板表面處理(Finished)的製程，一般簡稱之為「化鎳浸金板」，也有人將之簡稱 ...

Immersion gold is a process that applies a very thin layer of gold with displacement of the surface atoms. It means the coating is not very thick, and it can be ...

... immersion gold. A unique, reduction-assisted immersion gold process deposit higher thickness “4 to 8 μin gold” in a single step, with no corrosive ...

Compared with gold plating, immersion gold is easier to solder and will not cause poor welding. The stress of the immersion gold board is easier to control, and ...

ENIG (Immersion Gold) possesses flat surface, good heat dissipation, reworking availability, good for SMD, now is the most-used PCB surface finish.

Immersion Gold means nickel immersion gold, which is one of the surface finish for PCB. Immersion gold is cheaper than gold plated, so the shiny part of ...

化學鎳金（縮寫為ENIG，英語：Electroless nickel immersion gold），又名化鎳金或者沉鎳金，是印刷電路板的一種表面電鍍工藝。該工藝在銅表面鍍一層鎳磷合金，再在 ...

基板CCL: FR-4. 板厚Board thickness: 1.6mm. 銅厚Copper thickness: 1/1/1/1 oz. 防焊SM: 黑色Black. 表面處理Surface treatment: 化金2u ENIG 2u.