The substrate consists of an insulating material with conductive traces on or within it that route signals and power between the attached silicon die and the ...
The substrate is a small PCB with traces designed specifically for your package. The substrate is used for connecting the bumps to the solder balls and consists ...
2022年11月10日 — Choosing a suitable BGA substrate requires in-depth knowledge. In this guide, you will find all information you need to know about BGA ...
FC-BGA substrates. FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions.
ASE's substrate design and manufacturing capability enables the interconnection materials of a wide range of wire-bond BGA and flip chip product applications.
SHINKO supplies organic substrates using prepreg for BGA packages for logic, memory, and sensor devices. 2 layers or 4 layers through-hole substrates are used ...