![Hybrid bonding TSMC](https://host.easylife.tw/pics/202012/DSM7/01_DSM7.png)
2022年7月20日—因此有學者提出利用銅-銅異質接合(Cu-CuHybridBonding)技術,將金屬接點鑲嵌在介電材料(DielectricMaterial)之間,並同時利用熱處理接合兩種材料, ...,2023年7月28日—TSMCistheonlychipcompanythathascommercializedhybridbondingsofar.Called3DFabr...
TSMC-SoIC - 3DFabric
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Withtheinnovativebondingscheme,SoICtechnologyenablesthestrongbondingpitchscalabilityforchipI/Otorealizeahighdensitydie-to-dieinterconnects ...
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