![coreless substrate ppt](https://host.easylife.tw/files/vSubst_1.8.0.2.gif)
2022年3月8日—3LCorelesssubstrate.386ballsat0.3mmpitch.PCB.DAF.~1300solderballsat0.4mmpitch.Underfill.MobileDRAM.3DPoP:Apple/TSMCInFO ...,Furthermore,PPtdevelopedthefan-outpanel...Comparetoconventionalsubstrate,corelesssubstratetechnologyeliminate...
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C2iM=CopperConnectioninMaterial.StructureandFeature(3-layersubstrateforexample).•CorelesswithEmbeddedTraces.•AllEMC(epoxymoldingcompound) ...
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