![DBI hybrid bonding](https://host.easylife.tw/pics/202012/DSM7/01_DSM7.png)
DBI®Ultraisanenablinglow-temperature,lowprofiledie-to-waferanddie-to-diehybridbondingtechnologyplatform.Byeliminatingtheneedforcopper.,DBI®isalowtemperaturehybriddirectbondingtechnologythatallowswaferstobebondedwithexceptionallyfinepitch3Delectri...
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由JMudrick著作·2019·被引用12次—Thisworkdemonstratesa2.5-Dintegrationmethodusinga3micronCuDBIprocessona7.5micronpitchwithelectricalcontactsrangingbetween3.8and4.8 ...
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